Interfacing Technologies
The ability to successfully interface the brain to external electronics would have enormous implications for our society and facilitate a revolutionary change in the quality of life of persons with sensory and/or motor deficits caused by lack of innervation to native or tissue engineered constructs. Si Microelectrode technology represents the initial step towards this goal and has already improved the quality of life of many patients, as is evident from the success of auditory prostheses. However, when these devices are implanted into brain tissue for long-term recording, they quickly (over days) lose electrical connectivity.
Our laboratory is developing novel neuro-integrative coatings for Si micro-electrode arrays. Our coatings are both neuro-adhesive and are capable of delivery trophic and anti-inflammatory agents in the vicinity of the electrodes to promote integration and lessen the encapsulation response in vivo. Different aspects of this project are funded by NINDS (R01 NS 045072) and NIDCD (R01 DC06849) respectively.
Sub-Projects
Engineering the Interface Between Neural Implants and the Brain
- Wei He
Neuro-Integrative Coatings
- George McConnell
Finite Element Analysis of Electrode-Brain Interactions
- Hyun-Jung Lee
Neuro-Integrative Coatings
- Yinghui Zhong